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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
6 Bit D Register
The MC10E/100E151 contains 6 D-type, edge-triggered, master-slave flip-flops with differential outputs. Data enters the master when both CLK1 and CLK2 are LOW, and is transferred to the slave when CLK1 or CLK2 (or both) go HIGH. The asynchronous Master Reset (MR) makes all Q outputs go LOW.
MC10E151 MC100E151
* * * * * *
1100MHz Min. Toggle Frequency Differential Outputs Asynchronous Master Reset Dual Clocks Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors LOGIC DIAGRAM
D0 D R Q0 Q0
6-BIT D REGISTER
D1
D R
Q1 Q1
FN SUFFIX PLASTIC PACKAGE CASE 776-02
D2
D R
Q2 Q2
D3
D R
Q3 Q3
Pinout: 28-Lead PLCC (Top View)
MR CLK2 CLK1 24 23 NC 22 VCCO 21 Q5 20 Q5 19 18 17 16 15 14 13 12 5 NC 6 VCCO 7 Q0 8 Q0 9 Q1 10 Q1 11 VCCO Q4 Q4 VCC Q3 Q3 Q2 Q2
D4
D R
Q4 Q4 D5 D4 26 27 28 1 2 3 4
25
D5
D R
Q5 Q5
D3 VEE D2 D1 D0
CLK1 CLK2 MR
PIN NAMES
Pin D0 - D5 CLK1, CLK2 MR Q0 - Q5 Q0 - Q5
12/93
Function Data Inputs Clock Inputs Master Reset True Outputs Inverted Outputs
* All VCC and VCCO pins are tied together on the die.
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E151 MC100E151
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH IEE Characteristic Input HIGH Current Power Supply Current 10E 100E 65 65 min typ max 150 78 78 65 65 min 25C typ max 150 78 78 65 75 min 85C typ max 150 78 90 Unit A mA Condition
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol fMAX tPLH tPHL ts th tRR tPW tSKEW tr tf Characteristic Max. Toggle Frequency Propagation Delay to Output Clk MR Setup TIme D Hold Time D Reset Recovery Time Minimum Pulse Width CLK, MR Within-Device Skew Rise/Fall Times 20 - 80% 300 min 1100 typ 1400 max min 1100 25C typ 1400 max min 1100 85C typ 1400 max Unit MH z ps 475 475 0 350 750 400 65 450 700 300 650 650 -175 175 550 800 850 475 475 0 350 750 400 65 450 700 300 650 650 -175 175 550 800 850 475 475 0 350 750 400 65 450 700 ps ps 1 650 650 -175 ps 175 550 ps ps 800 850 ps Condition
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E151 MC100E151
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E151 MC100E151
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MOTOROLA 2-4
*MC10E151/D*
MC10E151/D ECLinPS and ECLinPS Lite DL140 -- Rev 4

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